LANIUS

Compact Mini Embedded Computer
for SWaP-Optimized Applications

State-of-the-Art Performance

Utilizes the latest processors to deliver high computational power in a compact system

Configurable I/O Expansion

Supports interfaces including MIL-STD-1553B, ARINC-429 (via MiniPCIe), Serial, Analog, Digital, and CAN

Extreme SWaP Efficiency

Excellent performance-to-size ratio in a rugged chassis (approximately 5.30 lbs)

Conduction Cooled

Sealed, fanless operation ensures reliable performance in extreme temperature environments

Integrated Communications

Optional support for GPS, Wi-Fi, cellular connectivity, and inertial measurement units (IMUs)

High-Speed Networking

Options available for both GigE and 10 GigE copper ports

Lanius is a next-generation mini rugged Small Form Factor (SFF) Application-Ready Platform built on open COMe architectures. It delivers high-end processing performance for mission-critical C5ISR and High-Performance Embedded Computing (HPEC) applications

Technical Specification

Processor - Intel® Core™ i7-13800HRE (13th Gen)

Cores/Threads - 6P+8E/20T

Dimensions mm - 162x260x80 mm / 6.40x10.25x3.15 inches

Weight - ≤ 5.3 – 5.75 lbs. (Configuration Dependent)

Memory - Up to 64 GB DDR5 RAM

Storage - Up to 1980GB with M.2 Interface

Power Input - 28 Vdc @ 45-60 Watts (Configuration Dependent)

I/O Expansion - MiniPCIe IO modules supported (including Acropack®)

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Technical Specification

Processor - Intel® Xeon® W-11865MRE (11th Gen)

Cores/Threads - 8C/16T

Dimensions - 162x260x80 mm / 6.40x10.25x3.15 inches

Weight - ≤ 5.3 – 5.75 lbs. (Configuration Dependent)

Memory - Up to 64 GB DDR5 RAM

Storage - Up to 1980GB with M.2 Interface

Power Input - 28 Vdc @ 45-60 Watts (Configuration Dependent)

I/O Expansion - MiniPCIe IO modules supported (including Acropack®)

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Lanius
13th Gen (High-Core Count/Hybrid Architecture)
Conduction Cooled