VNX+ Embedded Computing Modules – Technical Overview | ANSI VITA 90 Modular Systems

Modern defense, aerospace, and industrial platforms require high-performance computing, AI processing, networking, and connectivity within strict Size, Weight, and Power (SWaP) constraints. Traditional embedded architecture often limits scalability and make upgrades costly and complex.

The ANSI VITA 90 (VNX+) standard addresses these challenges through a modular architecture built around independently replaceable modules connected via standardized high-density SEARAY™ interfaces. This modular architecture supports varied pin configurations tailored to the specific power, signal, and I/O requirements of each module.

This overview explores the key modules within the Tekdense VNX+ ecosystem and how they deliver a rugged, scalable foundation for mission-critical embedded computing.

VNX+ SBC — Intel® Core™ or Atom™ Single Board Computer

The VNX+ SBC serves as the primary processing engine within a VNX+ system. It provides the essential balance of computing performance, power consumption, and thermal requirements dictated by specific mission profiles.

Processor Options: Intel® Core™ i7-1185GRE or Intel® Atom™ (x5-E3930 / x6425RE).
Memory: Up to 16GB DDR3L / LPDDR4x.
Standards: ANSI VITA 90.0-2026, SOSA™ Aligned.
Operating Temperature: -40°C to +70°C.
Connector: SEARAY™ i.

Designed for mission computing, sensor processing, command-and-control systems, and edge analytics, this module delivers reliable performance in harsh, deployed environments.

VNX+ GPGPU — NVIDIA Jetson Orin NX AI Accelerator

Modern defense platforms rely heavily on AI-driven capabilities such as real-time target recognition, sensor fusion, autonomous navigation, and predictive maintenance. The VNX+ GPGPU integrates the powerful NVIDIA Jetson Orin NX technology directly into the VNX+ ecosystem, enabling high-performance AI processing at the edge.

GPU Platform: NVIDIA Jetson Orin NX (1024 CUDA cores, 32 Tensor cores).
AI Performance: Up to 100 TOPS (INT8).
Memory: 16GB 128bit LPDDR5 DRAM.
Standards: ANSI VITA 90.0-2026, SOSA™ Aligned.
Operating Temperature: -20°C to +85°C.
Connector: SEARAY™ i.

VNX+ I/O Carrier — PCIe Peripheral Connectivity Module

Mission systems must interface with a vast array of sensors, payloads, and communication devices. The VNX+ I/O Carrier provides a flexible expansion framework that enables the rapid integration of application-specific interfaces while maintaining a standardized platform architecture.

Expansion: Dual mPCIe / AcroPack® slots (Full/Half Mini).
GPIO: 48 configurable Input/Output pins.
Power Input: 3.3VDC.
Standards: ANSI VITA 90.0-2026.
Operating Temperature: -40°C to +85°C.
Connector: 200-Pin SEARAY™ i.

Helios VNX+ PSU — Conduction-Cooled Power Supply

Reliable power delivery is a mandatory requirement for mission-critical systems. The Helios VNX+ PSU provides regulated multi-rail power distribution while incorporating advanced protection and health monitoring.

Input Voltage: +12VDC to +32VDC (+28VDC Nominal military power support).
Efficiency: 85% peak efficiency.
Protection: Over-Temperature, Under-Voltage, Over-Voltage, Over-Current, and Short-Circuit protection.
Health Monitoring: Per VITA 46.11 (IPMC).
Standards: ANSI VITA 90.3-2026, SOSA™ Aligned.
Operating Temperature: -40°C to +85°C.
Connector: SEARAY™ .

Helios PSU Filter — EMI and Transient Protection Module

Electrical noise and power transients are constant challenges in military vehicles, aircraft, and naval platforms. The Helios PSU Filter acts as a robust protective barrier, shielding sensitive electronics from conducted interference and power fluctuations.

Input Range: 12VDC to +36VDC.
Protection: Reverse voltage, power transient, and over-voltage protection.
Compliance: Designed to meet MIL-STD-461 and MIL-STD-704F requirements.
Operating Temperature: -40°C to +85°C.
Connector: 320-Pin SEARAY™ interface.

NetSpyder VX — VNX+ Layer 2/3 Managed Ethernet Switch

The NetSpyder VX provides managed Ethernet switching and routing capabilities to connect sensors, processors, operators, and external communication infrastructure.

Port Configuration: 8× Gigabit Ethernet ports, 3× QSGMII expansion ports, and 2× 10GbE SFI ports.
Switching Capabilities: Layer 2+ and Layer 3 static routing (IPv4/IPv6), OSPFv2, and IEEE 1588 Precision Time Protocol (PTP).
Standards: ANSI VITA 90.0-2026.
Operating Temperature: -40°C to +85°C.
Connector: 400-Pin SEARAY™ interface.

Common Module Specifications

All Tekdense VNX+ modules are engineered around a unified, ruggedized architecture to ensure interoperability and mechanical consistency.

Feature	Specification
Form Factor	19mm VNX+ Module
Dimensions	89 mm × 78 mm × 19 mm
Cooling	Conduction-Cooled, Fanless
Environment	Designed for MIL-STD-810H, MIL-STD-461G, MIL-STD-704F/1275F

The Strategic Value of VNX+

The primary advantage of the VNX+ architecture is its ability to bypass the need for extensive system redesigns as mission requirements evolve. Unlike traditional systems, VNX+ enables technology refreshes through simple modular replacement. Individual compute, network, power, or I/O modules can be upgraded independently, which significantly extends platform service life, reduces total lifecycle costs, and minimizes integration complexity. By standardizing the physical and electrical interface, defense integrators can adapt their platforms to changing operational demands—such as adding newer AI processors or specialized sensors—without the prohibitive cost of replacing entire system chassis.

Conclusion

The Tekdense VNX+ module ecosystem delivers a comprehensive, rugged embedded computing solution built on the open ANSI VITA 90 standard. By integrating high-performance compute, AI acceleration, deterministic networking, intelligent power management, and advanced EMI protection, the VNX+ architecture provides the scalability required for modern defense, aerospace, and industrial applications. Whether deployed in autonomous ground vehicles, UAV payload bays, or secure naval communications infrastructure, VNX+ empowers system designers to build high-performance solutions that remain relevant and ready for future operational requirements.

Contact the Tekdense Team

To discuss module configurations or integration options for your specific program, please contact our team directly Email: sales@tekdense.com Phone: +1 305-317-3646