{"id":436,"date":"2026-07-06T17:08:44","date_gmt":"2026-07-06T11:38:44","guid":{"rendered":"https:\/\/tekdense.com\/blogs\/?p=436"},"modified":"2026-07-22T11:42:17","modified_gmt":"2026-07-22T06:12:17","slug":"how-modular-i-o-carriers-are-changing-embedded-system-design","status":"publish","type":"post","link":"https:\/\/tekdense.com\/blogs\/how-modular-i-o-carriers-are-changing-embedded-system-design\/","title":{"rendered":"Embedded System Design"},"content":{"rendered":"\n

How Are Modular I\/O Carriers Changing Embedded System Design<\/h1>\n\n\n\n

Embedded computing platforms are increasingly expected to do more than process data \u2014 they need to connect to a growing mix of sensors, buses, and peripheral devices without adding unnecessary size or complexity to the system. As mission and industrial computing architectures evolve, the ability to add I\/O functionality on demand, rather than redesigning a system from scratch, has become an important design consideration.<\/p>\n\n\n\n

This is the kind of challenge a modular I\/O carrier is built to address. It’s a high-speed PCIe connectivity module designed to extend the I\/O capabilities of a host system through a modular, expansion-based approach. In this blog, we’ll look at why I\/O flexibility matters, why it needs a dedicated carrier, and how that carrier is built, configured, and where it fits in real world deployments .<\/p>\n\n\n\n

Why Modular I\/O Expansion Matters<\/strong><\/h2>\n\n\n\n

Modern embedded systems are rarely built around a single fixed I\/O configuration. Different deployments call for different combinations of interfaces \u2014 analog signals, digital I\/O, serial communication, or specialized data buses \u2014 and building a dedicated board for every combination isn’t practical.<\/p>\n\n\n\n

An I\/O carrier approach solves this by separating the core computing platform from the I\/O layer. Instead of committing to one fixed set of interfaces, system designers gain access to a range of I\/O modules that can be matched to what a given application requires. This kind of modularity is particularly valuable in demanding computing applications, where flexibility and scalability directly affect how easily a system can be adapted or reused across projects.<\/p>\n\n\n\n

Understanding VNX+<\/h2>\n\n\n\n

VNX+ systems are built around this kind of architecture. VNX+, also known as VITA 90, is an open embedded computing standard for small-form-factor, rugged, modular computing systems built around a 19 mm module. Its modular backplane lets functional modules \u2014 power supply, compute, GPU\/AI acceleration, I\/O, and networking \u2014 be inserted, removed, and replaced independently, which is a major reason VNX+ has gained traction in defense, aerospace, and industrial computing.<\/p>\n\n\n\n

Because compute and connectivity are separate modules in this architecture, a VNX+ system relies on a dedicated I\/O Carrier Module to link it to external devices and peripherals.<\/p>\n\n\n\n

What Is the VNX+ I\/O Carrier?<\/h2>\n\n\n\n

The VNX+ I\/O Carrier is a high-speed PCIe connectivity solution built to provide seamless integration between a VNX+ system and a range of external devices and peripherals. Rather than fixing I\/O functionality at the board level, the carrier acts as an interface point that accepts industry-standard miniPCIe \/Acropack\u00ae modules.<\/p>\n\n\n\n

Because it supports two of these modules simultaneously, the carrier allows a single VNX+ system to be configured with a varied mix of I\/O functionality \u2014 including ADC, DAC, digital I\/O, serial ports, 1553, and ARINC429 \u2014 simply by selecting the appropriate miniPCIe or Acropack\u00ae card. This turns I\/O expansion into a configuration decision rather than a hardware redesign.<\/p>\n\n\n\n

Standards and Architecture<\/h2>\n\n\n\n

The VNX+ I\/O Carrier connects into the system using a standard PCIe interface that follows ANSI VITA 90, which serves as the VNX+ Base Standard. Building the carrier around this standard interface means it integrates into the VNX+ ecosystem in a defined, predictable way, giving system designers a known interconnect to work with when planning system architecture.<\/p>\n\n\n\n

The carrier communicates with its miniPCIe \/ Acropack\u00ae modules through dedicated interfaces, which is what enables the modular I\/O expansion from ADC to ARINC429. This combination \u2014 a standardized system-level connection paired with configurable module interfaces \u2014 is central to how the carrier balances system-level consistency with application-level flexibility.<\/p>\n\n\n\n

Features That Enable Flexibility<\/h2>\n\n\n\n

Flexibility is central to how the VNX+ I\/O Carrier is built, and it comes down to a small set of core features:<\/p>\n\n\n\n

Feature<\/strong><\/strong><\/td>At a Glance<\/strong><\/strong><\/td><\/tr>
Expansion Slots<\/td>2 slots, each Full or Half miniPCIe \/ Acropack\u00ae<\/td><\/tr>
I\/O Functionality Supported<\/td>ADC, DAC, digital I\/O, serial ports, 1553, ARINC429<\/td><\/tr>
I\/O per Slot<\/td>48 pins<\/td><\/tr>
I\/O Routing<\/td>Routed per slot to a 200-pin Searay connector<\/td><\/tr>
Dimensions<\/td>3.5 x 3.07 x 0.75 in<\/td><\/tr>
Weight<\/td>0.55 lbs<\/td><\/tr>
Operating Temperature<\/td>-40\u00b0C to +85\u00b0C<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n

Applications<\/h2>\n\n\n\n

The VNX+ I\/O Carrier’s configurable slots make it a fit for systems that need to add or change I\/O functionality without a hardware redesign:<\/p>\n\n\n\n